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    Alloy GPU Cold Plates

    The new generation of hotter-than-ever semiconductors need a new generation of thermal solutions. Alloy’s components meet that need with new forms of micro-structures impossible to fabricate with other manufacturing techniques.

    • Improve data center Power Usage Effectiveness (PUE) by up to 18%

    • Provides lowest thermal resistance for high-performance chipsets

    • Lower pressure-drop reduces overall power consumption

    • Single-piece construction eliminates the risk of leaks

    Thermal Resistance and Pressure Drop

    Specifications

    Product NameAlloy MC-AMI3-AL
    CompatibilityAMD MI300 GPU
    MaterialAluminum 6061-T6
    (Copper 110 in beta)
    Dimensions
    (L x W x H)    		92.4 x 113.0 x 15.5 mm
    Cooling TechnologySingle-phase direct-to-chip liquid cooling using Alloy proprietary microcapillary flow system
    Thermal Resistance0.02 °C/W @ 1 LPM
    Pressure Drop1.3 psi @ 1 LPM

    Using a different chip, or looking for a customized product? Alloy’s team of applications engineers and manufacturing experts can work with your team to develop the solution you need.

    Section view of MI300 cold plate

    Why Alloy?

    Alloy’s proprietary microcapillary routing provides extraordinary cooling capability with very low pressure drop. The patented Stack Forging™ fabrication process enables extremely narrow channels (down to 180 microns), and uses all three dimensions to route coolant, resulting in  higher thermal performance with lower pressure drop.