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    Alloy GPU Cold Plates

    The new generation of hotter-than-ever semiconductors need a new generation of thermal solutions. Alloy’s components meet that need with new forms of micro-structures impossible to fabricate with other manufacturing techniques.

    • Improve data center Power Usage Effectiveness (PUE) by up to 18%

    • Provides lowest thermal resistance for high-performance chipsets

    • Lower pressure-drop reduces overall power consumption

    • Single-piece construction eliminates the risk of leaks

    Thermal Resistance and Pressure Drop*

    *Thermal resistance and pressure drop reflects aluminum data.

    Specifications*

    Using a different chip, or looking for a customized product? Alloy’s team of applications engineers and manufacturing experts can work with your team to develop the solution you need.

    Product NameAlloy MC-AMI3-AL
    CompatibilityAMD MI300 GPU
    MaterialAluminum 6061-T6
    (Copper 110 in beta)
    Dimensions
    (L x W x H)    		92.4 x 113.0 x 15.5 mm
    Cooling TechnologySingle-phase direct-to-chip liquid cooling using Alloy proprietary microcapillary flow system
    Thermal Resistance0.02 °C/W @ 1 LPM
    Pressure Drop1.3 psi @ 1 LPM
    Section view of MI300 cold plate

    Why Alloy?

    Alloy’s proprietary microcapillary routing provides extraordinary cooling capability with very low pressure drop. The patented Stack Forging™ fabrication process enables extremely narrow channels (down to 180 microns), and uses all three dimensions to route coolant, resulting in  higher thermal performance with lower pressure drop.