Reach Peak Performance With Alloy's Advanced Thermal Management Solutions


A New Generation Of Thermal Management For Electronics
Alloy’s custom-engineered components are designed for optimal thermal management, ideal for:
- Cold plates
- Vapor chambers
- Oscillating heat pipes
- Wafer cooling chuck
- Electronics enclosures with integrated coolings
Don’t see your application? Don’t worry! Alloy can work with your team to develop a custom cold plate or other liquid cooling component.
What Sets Us Apart

Custom Manufacturing for the Brands you Trust
Unlocking Next-Generation Thermal Applications
Micro-scale Features You Can’t Get Anywhere Else
Alloy’s patented Stack Forging™ process creates parts with features you can’t get from traditional manufacturing processes, including industry-leading micro-features in three dimensions.
Complex internal microcapillaries increase thermal performance
Measuring Excellence
Parts
Manufactured
Pounds of
Aluminum Used
Projects
Completed
How Can We Help?
Alloy’s applications engineers and manufacturing experts will work with your team to adapt, improve, or design components for your specific thermal application.
Design
Alloy’s applications engineers work with your team to produce a design that meets your needs.
Simulate
Alloy uses a variety of simulation tools including multi-physics thermal-fluid CFD and thermal-structural FEA methods.