Download our new whitepaper:
The Future of Liquid Cooling: Novel Microgeometry Architecture for Lower Pressure Drop & Higher Thermal Performance.
Cooling At Any Scale.
High-performance, leak-tight thermal management components built to cool where it matters most.
A New Generation of Thermal Management
From processors to peripherals, and across defense electronics and industrial systems, Alloy delivers leak-tight, single-piece thermal management components engineered for maximum heat transfer and low pressure drop, built to perform under the most crushing thermal loads and solve the industry’s toughest thermal challenges.
Ideal for:
- Direct liquid cooling (DLC) components
- High-efficiency vapor chambers
- Oscillating heat pipes
- Wafer cooling chucks
- Electronics enclosures with integrated cooling
Custom Needs?
We specialize in tailored thermal solutions that can be rapidly iterated using our Digital Manufacturing Suite + Stack Forging™, enabling rapid, tooling-free design cycles.
What Sets Us Apart
Custom Manufacturing for the Brands you Trust
Unlocking Next-Generation Thermal Applications
Alloy components provide exceptional heat transfer, lower pressure drop, and leak-tight, single-piece construction for:
Microgeometries You Can’t Get Anywhere Else
Our proprietary library of plug-and-play microgeometries, impossible to manufacture with any other process, deliver:
Targeted Cooling
Focused heat extraction where it matters most
Complex Microchannels
Boost thermal performance
Parallelized Flow Paths
Reduce pressure drop
Fully Dense, Leak-Tight Material
Suitable for ultra-high vacuum
Engineered to Cool. Built to Scale.
Measuring Excellence
Parts
Manufactured
Pounds of
Aluminum Used
Projects
Completed
End-to-End Support
Our engineers partner with you at every stage: design, simulation, testing, and production.
Design
Tailored solutions to meet your specs
Simulate
Multi-physics CFD and thermal-structural FEA
Test
In-house thermal, mechanical, and leak testing