Events

Join us at upcoming industry events for networking opportunities and great conversation about Alloy’s Stack Forging™ process

April 20 – 23, 2026

Data Center World

Walter E. Washington Convention Center | Washington D.C.

Booth #146

May 5 – 6, 2026

Thermal Management Expo

Huntington Convention Center | Cleveland, OH

Booth #1217

Presenting: Manufacturing 3D Microchannel Cold Plates at Scale for Next-Generation Chips

Presentation Date: Tuesday, May 5

Presentation Time: 10:00 – 10:20 AM

June 1 – 4, 2026

Datacloud Global Congress

Palais Des Festivals | Cannes, France

Attending will be Alloy’s CEO & Co-founder, Ali Forsyth, PhD., and Chief Product Officer, Bill Flaherty.

August 23 – 25, 2026

Hot Chips

Stanford University | Palo Alto, CA

Booth #TBD

October 12 – 15, 2026

Open Compute Project Global Summit

San Jose Convention Center | San Jose, CA

November 16 – 19, 2026

SC26

McCormick Place | Chicago, IL

Booth #5204

How Can We Help?

Alloy’s solutions provide lightweighting, integrated cooling, power efficiency, and system optimization to help prevent overheating while ensuring optimal performance for protecting resources such as high density servers, critical IT equipment, and machinery. From design and simulation to manufacturing, testing and qualification, Alloy delivers end-to-end support.

Design

Alloy’s applications engineers work with your team to produce a design that meets your needs.

Simulate

Alloy uses a variety of simulation tools including multi-physics thermal-fluid CFD and thermal-structural FEA methods.

Test

Alloy performs a wide variety of tests in-house, including thermal, mechanical and leak testing.