As AI and HPC racks climb toward 600 kW, the biggest cooling challenge is no longer GPUs; it’s the peripherals around them. This eBook explains why DIMMs, NICs, QSFPs, and power delivery are becoming the next thermal bottleneck, and how Alloy’s Stack Forging™ technology enables true 100% direct liquid cooling (DLC) across the entire blade. Learn how single-piece, leak-tight cold plates with advanced microchannel designs cut pressure drop, improve thermal resistance, and prepare data centers for next-gen high-density compute.

Key Takeaways

• Discover why peripherals are now the top thermal risk in AI and HPC racks.
• Learn where legacy multi-piece cold plates fail to support 100% DLC.
• See how Alloy’s Stack Forging technology unlocks full-blade liquid cooling with lower pressure drop and better thermal performance.